Multi-functional ambient light sensor packaging

ABSTRACT

A touchscreen display device includes: a display; a flexible printed circuit; touch sensing electrodes connected to the flexible printed circuit; and a multi-functional ambient light sensor package mounted on the flexible printed circuit. The multi-functional ambient light sensor package includes: an ambient light sensor; transmitter and receiver circuitry connected to the touch sensing electrodes via the flexible printed circuit; and a controller configured to obtain capacitance information from the touch sensing electrodes and ambient light information from the ambient light sensor via a single chip. The multi-functional ambient light sensor package may be packaged as a wafer-level chip-scale package (WLCSP).

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of U.S. Provisional PatentApplication No. 63/339,946, filed on May 9, 2022, which is herebyincorporated by reference in its entirety.

TECHNICAL FIELD

The described embodiments relate generally to electronic devices, andmore specifically, to multi-functional packages which include an ambientlight sensor (ALS).

BACKGROUND

Input devices, including capacitive sensor devices (e.g., touchpads ortouch sensor devices), are widely used in a variety of electronicsystems. A capacitive sensor device may include a sensing region, oftendemarked by a surface, in which the capacitive sensor device determinesthe presence, location and/or motion of one or more input objects.Capacitive sensor devices may be used to provide interfaces for theelectronic system. For example, capacitive sensor devices may be used asinput devices for larger computing systems (e.g., opaque touchpadsintegrated in, or peripheral to, notebook or desktop computers).Capacitive sensor devices are also often used in smaller computingsystems (e.g., touchscreens integrated in cellular phones). Capacitivesensor devices may also be used to detect input objects (e.g., finger,styli, pens, fingerprints, etc.).

Computing systems and input devices which utilize a capacitive sensoroften also include an ALS. In conventional systems and devices, the ALSand the touch controller are separately packaged, and the ALS ispackaged using a specialized optical package, such as a lead frame-basedpackage (e.g., of an optical dual flat no-lead (ODFN) type or an opticalquad flat no-lead (OQFN) type) or a substrate-based package (e.g., of anoptical land grid array (OLGA) type or a through silicon via (TSV)-basedball grid array (BGA) package type). The ALS may be asemiconductor-based ALS used to detect a level of ambient light, and thedetected level of ambient light can be used to set a brightness level ofthe display assembly within a portable or wearable device. For example,in a darker environment with little ambient light, the readings from ALScan cause the processor in a portable or wearable device to dim thedisplay assembly, and in a brighter ambient environment, the displayassembly can be made brighter.

SUMMARY

In an exemplary embodiment, the present disclosure provides atouchscreen display device. The touchscreen display device includes: adisplay; a flexible printed circuit; touch sensing electrodes connectedto the flexible printed circuit; and a multi-functional ambient lightsensor package mounted on the flexible printed circuit. Themulti-functional ambient light sensor package includes: an ambient lightsensor; transmitter and receiver circuitry connected to the touchsensing electrodes via the flexible printed circuit; and a controllerconfigured to obtain capacitance information from the touch sensingelectrodes and ambient light information from the ambient light sensorvia a single chip.

In a further exemplary embodiment, the flexible printed circuitcomprises a cutout, and wherein the ambient light sensor is configuredto detect ambient light that has passed through the cutout.

In a further exemplary embodiment, the display comprises an aperturealigned with the cutout, and wherein the ambient light detected by theambient light sensor passes through the aperture of the display beforepassing through the cutout of the flexible printed circuit.

In a further exemplary embodiment, the display is offset from thecutout, and wherein the touchscreen display device further comprises aspacer offset from the display.

In a further exemplary embodiment, the transmitter and receivercircuitry is further connected to an inductor, and wherein thecontroller of the multi-functional ambient light sensor package isfurther configured to obtain inductance information for inductivesensing.

In a further exemplary embodiment, the multi-functional ambient lightsensor package is packaged as a wafer-level chip-scale package (WLCSP).

In a further exemplary embodiment, the touchscreen display devicefurther includes heatsink material disposed between the display and theflexible printed circuit.

In another exemplary embodiment, the present disclosure provides acomputing device system. The computing device system includes: anantenna; a printed circuit board; and a multi-functional ambient lightsensor package mounted on the printed circuit board. Themulti-functional ambient light sensor package includes: an ambient lightsensor; a closure sensor; and a controller configured to obtaincapacitance information from the antenna for specific absorption rate(SAR) proximity sensing, closure information from the closure sensor,and ambient light information from the ambient light sensor via a singlechip.

In a further exemplary embodiment, the multi-functional ambient lightsensor package is packaged as a wafer-level chip-scale package (WLCSP).

In a further exemplary embodiment, the multi-functional ambient lightsensor package is packaged as an optical quad flat no-lead (OQFN)package, an optical dual flat no-lead (ODFN) package, or an optical landgrid array (OLGA) package.

In a further exemplary embodiment, the printed circuit board comprises acutout aligned with the ambient light sensor of the multi-functionalambient light sensor package, and the ambient light sensor is configuredto detect ambient light that has passed through the cutout.

In a further exemplary embodiment, the computing device system furtherincludes a microphone, a camera, and/or a second controller, wherein themicrophone, the camera, and/or the second control are disposed on theprinted circuit board and/or one or more other printed circuit boards.

In a further exemplary embodiment, the antenna is a laser directstructuring (LDS) antenna, a flexible printed circuit (FPC) antenna, aPCB antenna, or a discrete wire antenna.

In a further exemplary embodiment, the computing device system is partof a laptop, and the antenna, the printed circuit board, and themulti-functional ambient light sensor package are disposed in a top areaof a bezel of a lid of the laptop.

In a further exemplary embodiment, the computing device system is partof a tablet, and the antenna, the printed circuit board, and themulti-functional ambient light sensor package are disposed in a top areaof a bezel of the tablet.

In yet another exemplary embodiment, the present disclosure provides amulti-functional ambient light sensor package. The multi-functionalambient light sensor package includes: an ambient light sensor;transmitter and receiver circuitry connected to one or more electrodes;and a controller configured to obtain capacitance information from theone or more electrodes and ambient light information from the ambientlight sensor via a single chip.

In a further exemplary embodiment, the multi-functional ambient lightsensor package further includes a closure sensor, the controller isfurther configured to obtain closure information via the closure sensor,and the closure sensor is a Hall sensor or an inductive sensor.

In a further exemplary embodiment, the transmitter and receivercircuitry is further connected to an inductor, and the controller of themulti-functional ambient light sensor package is further configured toobtain inductance information for inductive sensing.

In a further exemplary embodiment, the multi-functional ambient lightsensor package is packaged as a wafer-level chip-scale package (WLCSP).

In a further exemplary embodiment, the multi-functional ambient lightsensor package is packaged as an optical quad flat no-lead (OQFN)package, an optical dual flat no-lead (ODFN) package, or an optical landgrid array (OLGA) package.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 depicts a schematic block diagram of an exemplary input device.

FIG. 2A depicts a device functional level block diagram of a wafer-levelchip-scale package (WLCSP) touch controller having an integrated ALSaccording to an exemplary embodiment.

FIG. 2B depicts a bottom view of the WLCSP touch controller having theintegrated ALS shown in FIG. 2A.

FIG. 2C depicts a side, cross-sectional view of the WLCSP touchcontroller having the integrated ALS shown in FIG. 2A.

FIG. 2D depicts the WLCSP touch controller of FIG. 2A being used forcapacitive sensing.

FIG. 2E depicts the WLCSP touch controller of FIG. 2A being used forinductive sensing.

FIG. 3A depicts a cross-sectional view of an exemplary wearable deviceaccording to an exemplary embodiment.

FIG. 3B depicts a bottom-up view of the FPC of FIG. 3A.

FIG. 3C depicts a top-down view of the wearable device of FIG. 3A.

FIG. 3D depicts a bottom-up view of internal components of the wearabledevice of FIG. 3A.

FIGS. 4A-4C depict another exemplary wearable device according to anexemplary embodiment.

FIG. 5 depicts yet another exemplary wearable device according to anexemplary embodiment.

FIG. 6 depicts a flowchart illustrating the manufacturing flow for aWLCSP package.

FIGS. 7A-7B depict an example of a 3-in-1 multi-functional WLCSP touchcontroller having SAR sensing capabilities, ambient light sensingcapabilities, and Hall sensing capabilities.

FIG. 7C depicts an example of a 3-in-1 multi-functional OQFN touchcontroller having SAR sensing capabilities, ambient light sensingcapabilities, and Hall sensing capabilities.

FIG. 7D depicts the device functional level block diagram of FIG. 7Awith sensory inputs associated with certain respective elements thereof.

FIG. 8A depicts an example of a laptop having a 3-in-1 multi-functionalWLCSP touch controller having SAR sensing capabilities, ambient lightsensing capabilities, and Hall sensing capabilities.

FIG. 8B depicts an example of a laptop having a 3-in-1 multi-functionalOQFN touch controller having SAR sensing capabilities, ambient lightsensing capabilities, and Hall sensing capabilities.

FIG. 8C depicts an example of a tablet (with accompanying keyboard)having a 3-in-1 multi-functional OQFN touch controller having SARsensing capabilities, ambient light sensing capabilities, and Hallsensing capabilities.

FIG. 9 is a block diagram showing a non-exhaustive set of exemplarycomponents of a computing device.

FIG. 10 is a flowchart depicting an exemplary process for utilizing a3-in-1 multi-functional ALS package.

DETAILED DESCRIPTION

The drawings and the following detailed description are merely exemplaryin nature, and are not intended to limit the disclosed technology or theapplication and uses of the disclosed technology. Furthermore, there isno intention to be bound by any expressed or implied theory presented inthe preceding technical field, background, or the following detaileddescription.

In the following detailed description of exemplary embodiments, numerousdetails are set forth in order to provide a more thorough understandingof the disclosed technology. However, it will be apparent to one ofordinary skill in the art that the disclosed technology may be practicedwithout these specific details. In other instances, well-known featureshave not been described in detail to avoid unnecessarily complicatingthe description.

Throughout the application, ordinal numbers (e.g., first, second, third,etc.) may be used as an adjective for an element (i.e., any noun in theapplication). The use of ordinal numbers is not to imply or create anyparticular ordering of the elements nor to limit any element to beingonly a single element unless expressly disclosed, such as by the use ofthe terms “before”, “after”, “single”, and other such terminology.Rather, the use of ordinal numbers is to distinguish between theelements. By way of an example, a first element is distinct from asecond element, and the first element may encompass more than oneelement and succeed (or precede) the second element in an ordering ofelements.

The following description of sensor patterns relies on terminology suchas “horizontal”, “vertical”, “top”, “bottom”, and “under” to clearlydescribe certain geometric features of the sensor patterns. The use ofthese terms is not intended to introduce a limiting directionality. Forexample, the geometric features may be rotated to any degree, withoutdeparting from the disclosure. Further, while patterns of certain sizesare shown in the drawings, the patterns may extend and/or repeat withoutdeparting from the disclosure. For example, the use of the term columnsand vertical direction is to distinguish between rows and the horizontaldirection, respectively. If the input device is rectangular, anydirection along the surface may be designated as the vertical directionby which a column extends and any substantially orthogonal directionalong the surface may be designated as a vertical direction along whichthe row extends.

As discussed above, in conventional input devices and computing systems,ALSs are packaged on their own, typically using specialized opticalpackages. However, in many computing environments, for example withrespect to wearable electronic devices, laptops, tablets, orsmartphones, the amount of available space is constrained. Exemplaryembodiments of the disclosure provide various multi-functional ALSpackages in which an ALS is integrated together with one or more othercomponents in an advantageous manner that achieves space savings, aswell as cost savings.

An example input device 100 is shown in FIG. 1 to provide an exampleenvironment to explain working principles of a capacitive sensor inconnection with a processing system. The input device 100 may beconfigured to provide input to an electronic system. As used in thisdocument, the term “electronic system” broadly refers to any systemcapable of electronically processing information. Some non-limitingexamples of electronic systems include personal computers of all sizesand shapes, such as desktop computers, laptop computers, netbookcomputers, tablets, web browsers, e-book readers, and personal digitalassistants (PDAs). Additional example electronic systems includecomposite input devices, such as physical keyboards that include inputdevice 100 and separate joysticks or key switches. Further exampleelectronic systems include peripherals such as data input devices, e.g.,remote controllers and mice, and data output devices, e.g., displayscreens and printers. Other examples include remote terminals, kiosks,and video game machines, e.g., video game consoles, portable gamingdevices, and the like. Other examples include communication devices,e.g., cellular phones such as smart phones, and media devices, e.g.,recorders, editors, and players such as televisions, set-top boxes,music players, digital photo frames, and digital cameras. Additionally,the electronic system could be a host or a slave to the input device.The electronic system may also be referred to as electronic device.

The input device 100 can be implemented as a physical part of theelectronic system, or can be physically separate from the electronicsystem. In one embodiment, the electronic system may be referred to as ahost device. As appropriate, the input device 100 may communicate withparts of the electronic system using any one or more of the following:buses, networks, and other wired or wireless interconnections. Examplesinclude I2C, SPI, PS/2, Universal Serial Bus (USB), Bluetooth, RF, andIRDA.

In FIG. 1 , the input device 100 is shown as a capacitive sensor deviceconfigured to sense input provided by one or more input objects 140 in asensing region 120. Example input objects 140 include fingers and styli,as shown in FIG. 1 . An exemplary capacitive sensor device may be atouchpad, a touchscreen, a touch sensor device and the like.

Sensing region 120 encompasses any space above, around, in and/or nearthe input device 100 in which the input device 100 is able to detectuser input, e.g., user input provided by one or more input objects 140.The sizes, shapes, and locations of particular sensing regions may varywidely from embodiment to embodiment. In some embodiments, the sensingregion 120 extends from a surface of the input device 100 in one or moredirections into space until signal-to-noise ratios prevent sufficientlyaccurate object detection. The distance to which this sensing region 120extends in a particular direction, in various embodiments, may be on theorder of less than a millimeter, millimeters, centimeters, or more, andmay vary significantly with the type of sensing technology used and theaccuracy desired. Thus, some embodiments sense input that comprises: nocontact with any surfaces of the input device 100; contact with an inputsurface, e.g., a touch surface, of the input device 100; contact with aninput surface of the input device 100 coupled with some amount ofapplied force or pressure; and/or a combination thereof. In variousembodiments, input surfaces may be provided by surfaces of casingswithin which the sensor electrodes reside, by face sheets applied overthe sensor electrodes or any casings, etc. In some embodiments, thesensing region 120 has a rectangular shape when projected onto an inputsurface of the input device 100.

The input device 100 may utilize any combination of sensor componentsand sensing technologies to detect user input in the sensing region 120.The input device 100 comprises one or more sensing elements fordetecting user input. As several non-limiting examples, the input device100 may utilize capacitive sensing, and may further utilize elastive,resistive, inductive, magnetic, acoustic, ultrasonic, and/or opticaltechniques.

Some implementations are configured to provide images (e.g., ofcapacitive signals) that span one, two, three, or higher dimensionalspaces. Some implementations are configured to provide projections ofinput along particular axes or planes.

In some capacitive implementations of the input device 100, voltage orcurrent is applied to create an electric field. Nearby input objectscause changes in the electric field, and produce detectable changes incapacitive coupling that may be detected as changes in voltage, current,or the like.

Some capacitive implementations utilize arrays or other regular orirregular patterns of capacitive sensing elements to create electricfields. In some capacitive implementations, separate sensing elementsmay be ohmically shorted together to form larger sensor electrodes. Somecapacitive implementations utilize resistive sheets, which may beuniformly resistive.

Some capacitive implementations utilize “self-capacitance” (also oftenreferred to as “absolute capacitance”) sensing methods based on changesin the capacitive coupling between sensor electrodes and an input object(e.g., between a system ground and freespace coupling to the user). Invarious embodiments, an input object near the sensor electrodes altersthe electric field near the sensor electrodes, thus changing themeasured capacitive coupling. In one implementation, an absolutecapacitance sensing method operates by modulating sensor electrodes withrespect to a reference voltage, e.g., system ground, and by detectingthe capacitive coupling between the sensor electrodes and input objects.In some implementations sensing elements may be formed of asubstantially transparent metal mesh (e.g., a reflective or absorbingmetallic film patterned to reduce or minimize visible transmission lossfrom the display subpixels). Further, the sensor electrodes may bedisposed over a display of a display device. The sensing electrodes maybe formed on a common substrate of a display device (e.g., on theencapsulation layer of a rigid or flexible organic light emitting diode(OLED) display). An additional dielectric layer with vias for a jumperlayer may also be formed of a substantially transparent metal meshmaterial (e.g., between the user input and the cathode electrode).Alternately, the sensor may be patterned on a single layer of metal meshover the display active area with cross-overs outside of the activearea. The jumpers of the jumper layer may be coupled to the electrodesof a first group and cross over sensor electrodes of a second group. Inone or more embodiments, the first and second groups may be orthogonalaxes to each other. Further, in various embodiments, the absolutecapacitance measurement may comprise a profile of the input objectcouplings accumulated along one axis and projected onto the other. Invarious embodiments, a modulated input object (e.g., a powered activestylus) may be received by the orthogonal electrode axes withoutmodulation of the corresponding electrodes (e.g., relative to a systemground). In such an embodiment, both axes may be sensed simultaneouslyand combined to estimate stylus position.

Some capacitive implementations utilize “mutual capacitance” (also oftenreferred to as “transcapacitance”) sensing methods based on changes inthe capacitive coupling between sensor electrodes. In variousembodiments, an input object near the sensor electrodes alters theelectric field between the sensor electrodes, thus changing the measuredcapacitive coupling. In one implementation, a transcapacitive sensingmethod operates by detecting the capacitive coupling between one or moretransmitter sensor electrodes (also referred to herein as “transmitterelectrodes” or “transmitters”) and one or more receiver sensorelectrodes (also referred to herein as “receiver electrodes” or“receivers”). The coupling may be reduced when an input object coupledto a system ground approaches the sensor electrodes. Transmitter sensorelectrodes may be modulated relative to a reference voltage, e.g.,system ground, to transmit transmitter signals. Receiver sensorelectrodes may be held substantially constant relative to the referencevoltage or modulated relative to the transmitter sensor electrodes tofacilitate receipt of resulting signals. A resulting signal may compriseeffect(s) corresponding to one or more transmitter signals, and/or toone or more sources of environmental interference, e.g., otherelectromagnetic signals. Sensor electrodes may be dedicated transmittersor receivers, or may be configured to both transmit and receive.

In FIG. 1 , a processing system 110 is shown as part of the input device100. The processing system 110 is configured to operate the hardware ofthe input device 100 to detect input in the sensing region 120. Theprocessing system 110 comprises parts of or all of one or moreintegrated circuits (ICs) chips and/or other circuitry components. Forexample, a processing system for a mutual capacitance sensor device maycomprise transmitter circuitry configured to transmit signals withtransmitter sensor electrodes, and/or receiver circuitry configured toreceive signals with receiver sensor electrodes. In some embodiments,the processing system 110 also comprises electronically-readableinstructions, such as firmware code, software code, and/or the like. Insome embodiments, components composing the processing system 110 arelocated together, such as near sensing element(s) of the input device100. In other embodiments, components of processing system 110 arephysically separate with one or more components close to sensingelement(s) of input device 100, and one or more components elsewhere.For example, the input device 100 may be a peripheral coupled to adesktop computer, and the processing system 110 may comprise softwareconfigured to run on a central processing unit of the desktop computerand one or more ICs (in another embodiment, with associated firmware)separate from the central processing unit. As another example, the inputdevice 100 may be physically integrated in a phone, and the processingsystem 110 may comprise circuits and firmware that are part of a mainprocessor (e.g., a mobile device application processor or any othercentral processing unit) of the phone. In some embodiments, theprocessing system 110 is dedicated to implementing the input device 100.In other embodiments, the processing system 110 also performs other userinput functions, such as operating display screens, measuring inputforces, measuring tactile switch state, driving haptic actuators, etc.

The processing system 110 may be implemented as a set of modules thathandle different functions of the processing system 110. Each module maycomprise circuitry that is a part of the processing system 110,firmware, software, or a combination thereof. In various embodiments,different combinations of modules may be used. Example modules includehardware operation modules for operating hardware such as sensorelectrodes and display screens, data processing modules for processingdata such as sensor signals and positional information, and reportingmodules for reporting information. Further example modules includesensor operation modules configured to operate sensing element(s) todetect input, identification modules configured to identify gesturessuch as mode changing gestures, and mode changing modules for changingoperation modes.

In some embodiments, the processing system 110 responds to user input(or lack of user input) in the sensing region 120 directly by causingone or more actions. Example actions include changing operation modes,as well as graphical user interface (GUI) actions such as cursormovement, selection, menu navigation, and other functions. In someembodiments, the processing system 110 provides information about theinput (or lack of input) to some part of the electronic system, e.g., toa central processing system of the electronic system that is separatefrom the processing system 110, if such a separate central processingsystem exists. In some embodiments, some part of the electronic systemprocesses information received from the processing system 110 to act onuser input, such as to facilitate a full range of actions, includingmode changing actions and GUI actions.

For example, in some embodiments, the processing system 110 operates thesensing element(s) of the input device 100 to produce electrical signalsindicative of input (or lack of input) in the sensing region 120. Theprocessing system 110 may perform any appropriate amount of processingon the electrical signals in producing the information provided to theelectronic system. For example, the processing system 110 may digitizeanalog electrical signals obtained from the sensor electrodes. Asanother example, the processing system 110 may perform filtering orother signal conditioning. The filtering may comprise one or more ofdemodulating, sampling, weighting, and accumulating of analog ordigitally converted signals (e.g., for finite impulse response (FIR)digital or infinite impulse response (IIR) switched capacitor filtering)at appropriate sensing times. The sensing times may be relative to thedisplay output periods (e.g., display line update periods or blankingperiods). As yet another example, the processing system 110 may subtractor otherwise account for a baseline, such that the information reflectsa difference between the electrical signals from user input and thebaseline signals. A baseline may account for display update signals(e.g., subpixel data signal, gate select and deselect signal, oremission control signal) which are spatially filtered (e.g., demodulatedand accumulated) and removed from the lower spatial frequency sensingbaseline. Further, a baseline may compensate for a capacitive couplingbetween the sensor electrodes and one or more nearby electrodes. Thenearby electrodes may be display electrodes, unused sensor electrodes,and or any proximate conductive object. Additionally, the baseline maybe compensated for using digital or analog means. As yet furtherexamples, the processing system 110 may determine positionalinformation, recognize inputs as commands, recognize handwriting, andthe like.

“Positional information” as used herein broadly encompasses absoluteposition, relative position, velocity, acceleration, and other types ofspatial information. Exemplary “zero-dimensional” positional informationincludes near/far or contact/no contact information. Exemplary“one-dimensional” positional information includes positions along anaxis. Exemplary “two-dimensional” positional information includesmotions in a plane. Exemplary “three-dimensional” positional informationincludes instantaneous or average velocities in space. Further examplesinclude other representations of spatial information. Historical dataregarding one or more types of positional information may also bedetermined and/or stored, including, for example, historical data thattracks position, motion, or instantaneous velocity over time.

In some embodiments, the input device 100 is implemented with additionalinput components that are operated by the processing system 110 or bysome other processing system. These additional input components mayprovide redundant functionality for input in the sensing region 120, orsome other functionality. FIG. 1 shows buttons 130 near the sensingregion 120 that can be used to facilitate selection of items using theinput device 100. Other types of additional input components includesliders, balls, wheels, switches, and the like. Conversely, in someembodiments, the input device 100 may be implemented with no other inputcomponents.

In some embodiments, the input device 100 comprises a touchscreeninterface, and the sensing region 120 overlaps at least part of adisplay screen. For example, the sensing region 120 may overlap at leasta portion of an active area of a display screen (or display panel). Theactive area of the display panel may correspond to a portion of thedisplay panel where images are updated. In one or more embodiments, theinput device 100 may comprise substantially transparent sensorelectrodes (e.g., ITO, metal mesh, etc.) overlaying the display screenand provide a touchscreen interface for the associated electronicsystem. The display panel may be any type of dynamic display capable ofdisplaying a visual interface to a user, and may include any type oflight emitting diode (LED), OLED, cathode ray tube (CRT), liquid crystaldisplay (LCD), plasma, electroluminescence (EL), or other displaytechnology. The input device 100 and the display panel may sharephysical elements. For example, some embodiments may utilize some of thesame electrical components for displaying and sensing. As anotherexample, the display panel may be operated in part or in total by theprocessing system 110.

A cathode electrode of an OLED display may provide a low impedancescreen between one or more display electrodes and the sensor electrodeswhich may be separated by a thin encapsulation layer. For example, theencapsulation layer may be about 10 um. Alternatively, the encapsulationlayer may be less than 10 um or greater than 10 um. Further, theencapsulation layer may be comprised of a pin hole free stack ofconformal organic and inorganic dielectric layers.

It should be understood that while many embodiments of the disclosureare described in the context of a fully functioning apparatus, themechanisms of the disclosure are capable of being distributed as aprogram product, e.g., software, in a variety of forms. For example, themechanisms of the disclosure may be implemented and distributed as asoftware program on information bearing media that are readable byelectronic processors, e.g., non-transitory computer-readable and/orrecordable/writable information bearing media readable by the processingsystem 110. Additionally, the embodiments of the disclosure applyequally regardless of the particular type of medium used to carry outthe distribution. Examples of non-transitory, electronically readablemedia include various discs, memory sticks, memory cards, memorymodules, and the like. Electronically readable media may be based onflash, optical, magnetic, holographic, or any other storage technology.

FIGS. 2A-2C depict an exemplary multi-functional ALS package 200 inwhich an ALS is integrated with a touch controller on a single die(e.g., a silicon die) in a wafer-level chip-scale package (WLCSP). TheWLCSP depicted in FIGS. 2A-2C is usable in connection with a displaydevice to provide both: (1) behind-display ALS functionality for atouchscreen display device, such as a wearable device or a smartphone;and (2) touch control functionality with respect to the touchscreendisplay device's touch sensing capabilities. It will be appreciated thata WLCSP package is a class of semiconductor package that is based on thedie level package, as opposed to other packages that encapsulate the diewith a mold compound (e.g., LQFP, QFN, BGA). A WLCSP generally has arelatively small outline since it is based on the die, and the WLCSP isprocessed based on a wafer level process (e.g., RDL—redistribution layerplus solder balls).

FIG. 2A depicts a device functional level block diagram of a WLCSP touchcontroller having an integrated ALS according to an exemplaryembodiment. The block diagrams includes controller 201, which can bebased on any number of microcontrollers architectures (e.g., ARM, RISCV, 8051) and/or an array logic that provides overall control of thedevice. Memory 202 provides storage for the controller firmware andstorage for controller data calculations. The photosensor 203 is a lightsensitive semiconductor device that may be based on a diode, atransistor and or array of either diodes or transistors. An analog frontend (AFE) 204 provides the conversion of an analog signal to digitalsignal. The analog signals can be from external sensors (such ascapacitive sensing electrodes as shown in FIG. 2D or an inductive-basedsensor as shown in FIG. 2E). The conversion from an analog signal todigital signal is typically accomplished by ADC (analog-to-digitalconversion) with some level of signal processing and filtering. Tx 206comprises transmitter circuitry for outputting stimulus signals for oneor more transmitters, and Rx 205 comprises receiver circuitry forobtaining resulting signals corresponding to the stimulus signals. Forexample, in accordance with FIG. 2D, Rx 205 and Tx 206 may be connectedto one or more receiver electrodes 207 and one or more transmitterelectrodes 208, respectively, for transcapacitive sensing. In anotherexample, in accordance with FIG. 2E, Rx 205 and Tx 206 may be connectedto an inductor 209 for inductive sensing with respect to a metal target210. It will further be appreciated that in another example, Rx 205 andTx 206 may include multiple Rx and Tx channels, such thatmulti-functional ALS package 200 is capable of performing bothtranscapacitive sensing and inductive sensing (in addition to ambientlight sensing as discussed below in connection with FIGS. 2B-2C). Itwill be appreciated that, unless contradicted by context or expresslyprecluded, “connected” (or “coupled”) includes both direct and indirectconnections or couplings.

FIG. 2B depicts a bottom view of the WLCSP touch controller having theintegrated ALS shown in FIG. 2A, and FIG. 2C depicts a side,cross-sectional view of the WLCSP touch controller having the integratedALS shown in FIG. 2A. As shown in FIGS. 2B and 2C, there are a pluralityof solder balls 211 attached to the bottom of the WLCSP touch controllerfor connecting various components of the WLCSP touch controller to aflexible printed circuit (FPC). Additionally, photosensor 203 isdisposed on the bottom of the WLCSP touch controller and is positionedsuch that the photosensor 203 does not overlap with redistribution layer(RDL) routing of the WLCSP and ball grid array (BGA) balls of the WLCSP.In this example, the photosensor 203 has an overall length of 115 μm andan overall width of 50 μm and includes two individual photosensors(e.g., diode or transistor devices or arrays thereof) corresponding tothe two squares depicted in the photosensor area. It will beappreciated, however, that the location and dimensions of thephotosensor 203 shown in FIG. 2B are merely exemplary, and that thephotosensor 203 may be disposed in a different location and/or havedifferent dimensions without departing from the principles discussedherein.

A protective coating and/or an oxidation coating may be provided overthe top of a die where the photosensor 203 is located. For example, anoptically clear polyimide (PI) coating may be used to protect theexposed photosensor from damage during assembly onto a printed circuitboard (PCB) or FPC. Additionally, an infrared optical cut-off filterover the photo sensor for mimicking a human visual response.

It will be appreciated that the configurations shown in FIGS. 2A-2E aremerely examples, and that the components depicted therein may bearranged in different locations without departing from the principlesdiscussed herein.

FIG. 3A depicts a cross-sectional view of an exemplary wearable device300 (e.g., an activity band to be worn on a user's wrist) which includesan exemplary implementation of the multi-functional ALS package 200 ofFIGS. 2A-2C. FIG. 3A further depicts an FPC 302, a heatsink foam layer303, a display 304, an indium tin oxide (ITO) layer 305, and a coverglass 306. The multi-functional ALS package 200, which is a WLCSP touchcontroller having an integrated ALS, is mounted on the FPC 302, and theFPC is separated from the display 304 by the heatsink foam layer 303.

FPC 302 provides an interconnect media between the touch controller (themulti-functional ALS package 200) and the touchscreen layer (which maycomprise clear ITO electrodes of ITO layer 305 deposited on the OLEDencapsulation glass of the display 304). FPC 302 in some cases may alsoprovide the interconnect to a display driver IC. Heatsink foam layer 303is as a heat dissipation layer for dissipating heat that is generatedfrom operation of the OLED display. In the case of a glass-based OLEDmodule, a foam material may be used both as a heatsink and for shockabsorption to prevent damage to the glass OLED. In the case of aflexible OLED, a copper foil layer may be used for heat dissipation forheat generated by the plastic OLED module. As can be seen from FIG. 3A,for realization of the ALS function of the multi-functional ALS package200 positioned behind the display 304, the overall wearable device 300is configured to provide a field of view (FOV) for the ALS to allow theALS to detect ambient light.

It will be appreciated that the display 304 in FIG. 3A is a glasssubstrate-based OLED display. For glass substrate-based OLED displaymodules, the touchscreen layer is typically implemented through a layerof optically clear ITO commonly deposited on top of the topencapsulation glass. Connection from the touch controller to this arrayof ITO electrodes is accomplished by attaching a FPC via conductiveadhesive known as Anisotropic Conductive Adhesives (ACA). In anotherexemplary embodiment, for a flexible plastic-based substrate OLED, thestack up may be very similar with glass substrate with a few materialdifferences (e.g., the heatsink layer may be a copper foil layer, andthe OLED display may be flexible instead of glass, and the touchelectrodes may be implemented as a metal mesh touchscreen layer).

The display 304 may be, for example, an organic light-emitting diode(OLED) display device (e.g., a passive-matrix OLED (PMOLED) or anactive-matrix (AMOLED) display device), and as discussed above, thedisplay 304 may be based on either a glass or plastic substrate. ForAMOLEDs, the display substrates that are commonly in use can be glass ora plastic substrate based on a polyimide material. As shown in FIG. 3A,components of the display 304 are positioned such that a clear area(i.e., an aperture) is provided through the display 304. This clear areais aligned with a field of view of the photosensor of themulti-functional ALS package 200 and respective cutouts of the FPC 302and the heatsink foam layer 303.

FIG. 3B depicts a bottom-up view of the FPC 302 depicted in FIG. 3A. TheFPC 302 includes solder pads 321 (for attachment to corresponding solderballs of the multi-functional ALS package 200) and a cutout 320 to allowfor ambient light to pass through the FPC 302. The size and location ofthe cutout 320 is aligned to the FOV of the ALS of the multi-functionalALS package 200 and allows for an appropriate amount of ambient light(e.g., at least an amount of light exceeding a minimum brightnessdetection level of the ALS) to pass through to the photosensor 203 onthe die of the multi-functional ALS package 200. Additionally, the sizeand location of the cutout 320 avoids violating any design rules forpitch and/or distance with respect to adjacent solder ball pads and/orFPC vias. In an example, the cutout 320 may have a length of 120 μm andan overall width of 60 μm (based on the photosensor 203 having anoverall length of 115 μm and an overall width of 50 μm). It will beappreciated, however, that the location and dimensions of the cutout 320shown in FIG. 3B are merely exemplary, and that the cutout 320 may bedisposed in a different location and/or have different dimensions basedon the position and the size of a corresponding photosensor. It will beappreciated that the cutout in the heatsink foam layer 303 may bealigned with and may have a similar size to the cutout 320 of the FPC302.

FIG. 3C depicts a top-down view of the wearable device 300 of FIG. 3A.As can be seen in FIG. 3C, the cover glass 306 is the top layer of thewearable device 300. The location of photosensor 203 of themulti-functional ALS package 200 is also indicated in FIG. 3C, but itwill be appreciated that a user of the wearable device 300 may not beable to discern based on looking at the wearable device 300.

FIG. 3D depicts a bottom-up view of internal components of the wearabledevice 300 of FIG. 3A. An example of an FPC 302 is shown as being behinda display 304, with a display driver 340 and a multi-functional ALSpackage 200 being mounted on the FPC 302. The FPC 302 further include aconnector 370, which provides the main input and output for the displaymodule. Inputs may include power and control signals for both thecontroller and display. Outputs may include outputs signals from thetouch controller such as I2C, SPI, USB and or GPIO (General PurposeInput and Outputs) signals.

FIGS. 4A-4C depict another exemplary wearable device 400 according to anexemplary embodiment. Wearable device 400 includes components similar tothat of wearable device 300, but wearable device 400 includes amulti-functional ALS package being mounted in a different position on anFPC such that the FOV of the ALS does not pass through the display ofthe wearable device 400. Instead, the FOV of the ALS passes through anaperture in the housing of the wearable device 400.

FIG. 4A depicts a cross-sectional view of the wearable device 400. Ascan be seen in FIG. 4A, ambient light passes through an aperture of thewearable device 400 (which includes a cutout in the FPC) without passingthrough the display of the wearable device 400. FIG. 4A further depictsa spacer 401 between the FPC and the cover glass in a position where thedisplay does not overlap with the FPC and the cover glass.

FIG. 4B depicts a top-down view of the wearable device 400 of FIG. 4A.The location of an aperture 410 in the housing of the wearable device400 is depicted in FIG. 4A. It will be appreciated that the aperture 410may not be noticeable to a user of the wearable device 400.

FIG. 4C depicts a bottom-up view of internal components of the wearabledevice 400 of FIG. 4A. Similar to FIG. 3D, an example of an FPC is shownas at least partially being behind a display, with a display driver anda multi-functional ALS package being mounted on the FPC, and the FPCfurther include a connector.

FIG. 5 depicts yet another exemplary wearable device 500 according to anexemplary embodiment. As discussed above, a flexible plastic-basedsubstrate OLED (for example, as shown in FIG. 5 ) may be similar to aglass-based substrate OLED (for example, as shown in FIGS. 3A and 4A)with a few material differences. As shown in exemplary wearable device500, the device includes a copper foil heatsink layer 503, a flexibleplastic-based OLED display 504 (which may be based on a polyimideplastic substrate), and a metal mesh touchscreen layer 505, while alsoincluding a multi-functional ALS package 200, FPC 302 and cover glass306 (similar to multi-functional ALS package 200, FPC 302 and coverglass 306 discussed above in connection with FIG. 3A).

The exemplary embodiments depicted in FIGS. 2A-5 provide variousadvantages, for example, with regard to space-savings withinapplications which are constrained to a confined space, as well as withregard to cost. Touch-sensitive wearable devices (such as activitybands, smart watches, medical monitoring devices, smart clothing andwireless stereo earphones) are one example of a space-constrained andcost-sensitive application. For wearable devices and for other devices(e.g., devices which include a touch user interface, ambient lightsensing functionality, and an OLED display), the above-discussedexemplary embodiments provide a tightly integrated and advantageoussolution using integrated circuit (IC) packaging. Based on integratingthe touch controller with the ALS in a WLCSP, space savings can beachieved for space-confined devices. Further, by utilizing a WLCSP forthe ALS (as opposed to an ODFN or OLGA or other optical packaging), alower-cost package is achieved, thereby also providing a lower overallbill-of-material (BOM) cost for device manufacturers.

FIG. 6 depicts an exemplary flowchart for forming the multi-functionalALS package 200 of FIGS. 2A-2C and the wearable devices 300, 400, 500 ofFIGS. 3A-5 . At stage 601, a wafer is obtained from a foundry. At stage603, a first polyimide layer (PI-1) is formed. PI-1 may be a stressrelief and protective insulating layer provided prior to theredistribution layer being formed, and it may have high thermalstability, chemical resistance and low flammability. At stage 605, acopper redistribution layer (RDL) is formed to interconnect the die tothe board level. At stage 607, a second polyimide layer (PI-2) is formedto provide a dielectric layer between the RDL layer and an under ballmetallization (UBM) layer. At stage 609, a copper UBM layer is formedfor a chip-scale package (CSP) ball drop. Further, it will beappreciated that stages 603-609 correspond to photosensor keep-outcreation, whereby based on stages 603-609, the WLCSP is formed in amanner which is able to accommodate an ALS in the manner shown in FIGS.3A-5 .

At stage 611, the ball drop and reflow is performed to form a CSPstandoff. At stage 613, a wafer level chip probe test is performed. Atstage 615, the wafer is backgrinded to a desired thickness for thepackage. At stage 617, the backside of the wafer is coated with aprotection layer to protect the CSP silicon from cracking due tohandling. At stage 619, laser marking is performed (e.g., with respectto a marking logo, date code, and/or product information). At stage 621,wafer sawing is performed to dice the package into singular units. Atstage 623, the package is packed (e.g., tape & reel vacuum packaging)for an assembly vendor.

At stage 625, a flexible circuit board is designed such that thefootprint on the FPC is in alignment with the CSP ball array (and theFPC may have a cutout as described above aligned with an ALSphotosensor). At stage 627, the CSP is mounted on the FPC using surfacemount soldering technology. At stage 629, the FPC module may then belaminated to a display.

It will be appreciated that the foregoing process described inconnection with FIG. 6 is merely an example, and that other exemplaryembodiments may omit certain steps, add certain steps, and/or modifycertain steps. For example, in an exemplary embodiment, the process mayinclude an additional step of forming an infrared optical cut-off filterover the photosensor for mimicking a human visual response.

Exemplary embodiments of the present disclosure utilize semiconductordevices as an advantageous platform for integration of multiple types ofsensing technologies due to the unique material properties ofsemiconductors. For example, as discussed above, sensing technologiessuch as capacitance sensing, inductive sensing, and ambient lightsensing may be integrated on a semiconductor platform. Further exemplaryembodiments may further integrate other types of sensing, such astemperature sensing and magnetic field sensing. A Hall Effect sensor isone example of a device that can be used to for detecting the presence,strength and direction of a magnetic field produced from a permanentmagnet or other magnetic field sources.

The exemplary embodiments discussed above in connection with FIGS. 2A-5are applicable, for example, to touchscreen display devices, such aswearable devices and smartphones. It will be appreciated, however, thatthe principles discussed herein are also applicable in other situations,for example, with respect to laptops, tablets, and smartphones whichutilize ALSs and/or closure detection. In the following embodimentsdiscussed below in connection with FIGS. 7A-9 , multi-functional ALSpackages are discussed which have 3-in-1 functionality with respect tospecific absorption rate (SAR) sensing (which is capacitive sensing forwhether or not a human is proximate to a mobile device withinFCC-mandated SAR requirements), ambient light sensing, and Hall sensingfor closure detection (e.g., detecting whether a lid of a laptop isclosed or detecting whether a tablet has been folded/covered). It willbe appreciated that, although SAR sensing is different from touchsensing, a 3-in-1 multi-functional ALS package which performs SARsensing, ambient light sensing, and Hall sensing may still be referredto as a touch controller with integrated ALS. It will further beappreciated that instead of Hall sensors, there are other ways to detectclosure, such as through inductive sensing, Thus, a 3-in-1multi-functional ALS package which performs SAR sensing, ambient lightsensing, and closure sensing may be characterized as included a “closuresensor,” wherein the closure sensor may be, for example, a Hall sensoror an inductive sensor.

FIG. 7A depicts a device functional level block diagram of a 3-in-1multi-functional WLCSP touch controller having SAR sensing capabilities,ambient light sensing capabilities, and Hall sensing capabilities. The3-in-1 multi-functional WLCSP touch controller is a multi-functional ALSpackage 700 with an ALS (photosensor 203) and a Hall sensor 707. TheHall sensor 707 may use the same AFE 204 as other components of themulti-functional ALS package for measuring a Hall effect voltage.

FIG. 7B depicts top and side views of the multi-functional ALS packagedepicted in FIG. 7A with WLCSP packaging. As illustrated in FIG. 7B,there are four Hall plates, wherein a respective Hall plate is placed ineach corner of the die. It will be appreciated that the four Hall platesin FIG. 7B are exemplary, and a different number of Hall plates may beused in other exemplary implementations. The number of Hall plates usedmay depend on the intended application for the multi-functional ALSpackage (e.g., providing placement flexibility of the permanent magnets,linear displacement detection, rotational displacement detection,horizontal and/or vertical magnetic field detection).

FIG. 7C depicts an example of a 3-in-1 multi-functional OQFN touchcontroller having SAR sensing capabilities, ambient light sensingcapabilities, and Hall sensing capabilities. The construction of thetouch controller with the ALS on a semiconductor platform is similar tothe embodiments described above, but instead of being packaged with RDLsolder balls providing connections to an FPC, the packaging is OQFNpackaging with optical QFN bond wires to a lead frame pad. It will beappreciated that in other exemplary embodiments, an ODFN or an OLGApackage may be used instead of an OQFN package.

FIG. 7D depicts the device functional level block diagram of FIG. 7Awith sensory inputs associated with certain respective elements thereof.As discussed above, the 3-in-1 multi-functional WLCSP touch controllerhas SAR sensing capabilities, ambient light sensing capabilities, andHall sensing capabilities. The sensor input for ambient light sensing isbased on ambient light, and the ambient light is detected by photosensor203. The sensory input for closure detection is based on magnetic fieldstrength, and the magnetic field strength is detected by Hall sensor707. The sensory input for SAR proximity sensing is based oncapacitance, and the capacitance is detected via Rx 205 and Tx 206.

FIG. 8A depicts an example of a laptop 800 having a 3-in-1multi-functional WLCSP touch controller having SAR sensing capabilities,ambient light sensing capabilities, and Hall sensing capabilities. Itwill be appreciated that a laptop typically has capability to transmitwireless RF (radiofrequency) signals such as WiFi, Bluetooth and/orcellular (5G, 4G, LTE, GSM) through an antenna assembly 804. Wirelessconnectivity is typically subject to regulatory safety emissionsrequirements, such as the FCC SAR requirement of 1.6 W/kg from adistance of 0 mm to 10 mm to a human body. As shown in FIG. 8A, SARproximity sensing may be used in a laptop for monitoring for thepresence of a human body, and based on the SAR proximity sensing, thelaptop may regulate the radiated RF power output 806 to be within theregulatory limits (e.g., 1.6 W/Kg). An antenna (such as a laser directstructuring (LDS) antenna, an FPC antenna, a PCB antenna, or a discretewire antenna) of the laptop may be used as a capacitive sensor forperforming SAR proximity sensing. The ambient light sensingfunctionality of the laptop may be used to regulate the brightness ofthe laptop display based on ambient light conditions. Additionally, thelaptop may include a permanent magnet disposed on a bottom portion ofthe base of the laptop beneath a touchpad of the laptop, such that lidclosure detection sensing may be performed using a Hall sensor (or aninductive sensor) in a corresponding top portion of the lid of thelaptop. Since there is a limited amount of space available in the bezelaround the display, and the space in the bezel may be used toaccommodate various other components as well (such as microphone andcamera and their corresponding circuit board(s)), it is advantageous tointegrate SAR sensing capabilities, ambient light sensing capabilities,and Hall sensing capabilities into a single package (such as the WLCSPpackage depicted in FIG. 8A) disposed in the top portion of the lid ofthe laptop. The resultant integration of these multiple functions into asingle chip package allows for laptop manufacturers to reduce the numberof discrete components that need to be located inside the limited bezelarea and may provide for advantageously reducing the size of the bezel.

The left side of FIG. 8A illustrates a perspective schematic view of anexemplary laptop 800. The laptop 800 includes a permanent magnet 805 inthe bottom portion of the base below a touchpad of the laptop 800, andthe laptop 800 radiates RF power output 806 during operation. The lid ofthe laptop contains a top portion 801 of the bezel around a display ofthe laptop, and as depicted in the top right portion of FIG. 8A, thistop portion 801 includes an antenna assembly 804 (e.g., an LDS antennaassembly, an FPC antenna assembly, a PCB antenna assembly, or a discretewire antenna assembly) with electrode 803 (which may be formed of silverink, copper, and/or gold plating) which serves as a wireless antennaused for SAR proximity sensing, connected to a PCB 802 via an FPC. ThePCB includes a lid controller (LID CTRL), a microphone, and a camera, aswell as a multi-functional ALS package implemented as a WLCSP touchcontroller having an integrated ALS. The lid controller may be, forexample, a microcontroller or a custom application-specific integratedcircuit (ASIC) which provides for interface aggregation for variouscomponents located at the top of the lid of the laptop, such as varioussensors and microphones. The lid controller may, for example, havevarious interfaces (such as I2C, SPI, and/or GPIO), and convert theminto a single USB stream sent down through the laptop hinge to a maincentral processing unit (CPU) or sensor hub processor located on a mainPCB of the laptop.

It will be appreciated that although FIG. 8A depicts all of thesecomponents as being disposed on a single PCB, in variousimplementations, the components may be disposed on one or more PCBs (forexample, the camera and microphone may have their own PCB separate fromthe PCB to which the multi-functional ALS package is attached). Asdepicted in the middle right portion of FIG. 8A (which is across-sectional side view of the PCB and the WLCSP touch controllermounted on a back side of the PCB), the PCB includes an aperture toallow ambient light to pass through to the ALS of the WLCSP touchcontroller. As depicted in the bottom right portion of FIG. 8A (which isa bottom view of the WLCSP touch controller), the bottom side of theWLCSP touch controller includes a plurality of solder balls, a pluralityof hall plates, and a photosensor.

It will be appreciated that FIG. 8A shows an example of a laptop havingthe multi-functional ALS package depicted in FIG. 7B. FIG. 8B shows anexample of a laptop having the multi-functional ALS package depicted inFIG. 7C, and it will be appreciated that the elements depicted in FIG.8B are similar to those depicted in FIG. 8A, except that themulti-functional ALS package of FIG. 7B is replaced with themulti-functional ALS package of FIG. 7C, which is a 3-in-1multi-functional OQFN touch controller having SAR sensing capabilities,ambient light sensing capabilities, and Hall sensing capabilities. Asdiscussed above, it will be appreciated that in other exemplaryembodiments, an ODFN or an OLGA package may be used instead of an OQFNpackage.

It will further be appreciated that, although FIGS. 8A-8B depictmulti-functional ALS packages in the context of a laptop environment,these multi-functional ALS packages may also be used in other deviceenvironments, such as tablets and smartphones which are also subject toSAR requirements. For example, FIG. 8C depicts an example of a tablet(with accompanying keyboard) having a 3-in-1 multi-functional OQFN touchcontroller having SAR sensing capabilities, ambient light sensingcapabilities, and Hall sensing capabilities. It will be appreciated thatthe elements depicted in FIG. 8C are similar to those depicted in FIG.8B, except that the multi-functional ALS package is implemented as partof a tablet instead of a laptop. The depicted keyboard has anaccompanying keyboard which can be folded to cover the tablet, and thekeyboard is implemented with a permanent magnetic for closure detection.In an alternative implementation, a cover without a keyboard may also beutilized in a similar manner.

FIG. 9 is a block diagram showing a non-exhaustive set of exemplarycomponents of a computing device, such as the laptops and tabletdepicted in FIGS. 8A-8C. The computing device includes one or moreprocessors (including a graphics processor which may be integrated witha central processor or may be separate from the central processor), awireless communications modem, audio codec(s), one or more memories(which may include, for example, random access memory (RAM), harddrives, and/or solid state drives), speaker(s), microphone(s), atouchscreen display, a battery, a multi-functional ALS package asdescribed herein (which may include sensors such as an ALS and a Hallsensor), and various other sensors (which may include, for example,accelerometer(s), gyroscope(s), a magnetometer, and/or a temperaturesensor). The computing device also includes appropriate interface busesfor various components to communicate with one another, such as I2C,SPI, I3C and/or USB interfaces.

FIG. 10 is a flowchart depicting an exemplary process for utilizing a3-in-1 multi-functional ALS package. At stage 1101, the ALS sensor ofthe multi-functional ALS package of a computing device is utilized toobtain an ALS measurement. It will be appreciated that ambientbrightness levels may vary through variety of conditions—for example, inan office environment, the ambient brightness level may be in the rangeof 300 to 500 Lux, while for an outdoor environment on the order of10,000 Lux or more. At stage 1103, based on a predetermined ambientlight threshold level (which may be user-defined), the computing devicemay determine whether the computing device is in a closed position or anopen position (e.g., if the computing device is a laptop, it maydetermine whether its lid is open or closed; if the computing device isa tablet or smartphone, it may determine whether the screen is covered;or if the computing device is a foldable smartphone, it may determinewhether the foldable smartphone has been folded shut). Further, it willbe appreciated that if the ambient light is detected as being above thethreshold and the computing device is thus in the open position, themagnitude of the ALS measurement may be used for other purposes, such asto adjust a brightness of the display of the computing device.

At stage 1105, the computing device obtains a Hall effect measurementvia a Hall sensor of the multi-functional ALS package, and at stage1107, the computing device compares the obtained Hall effect measurementto a magnetic field threshold. If the Hall effect measurement exceedsthe threshold, the computing device determines the computing device isin the closed state (stage 1109) and, based thereon, may further turnoff its display and/or go into a low power state (stage 1111). On theother hand, if the Hall effect measurement does not exceed thethreshold, the computing device determines the computing device is stillopen, and may, for example, remain in an active state and/or keep thedisplay on.

As shown in FIG. 10 , stage 1105 may be performed in response to an ALSmeasurement being below an ambient light threshold in order tocorroborate whether the computing device is indeed in the closedposition, as suggested by a low ambient light level. For example, theremay be situations where the ALS measurement is low due to a userintentionally covering a camera (e.g., a webcam) of the computing devicefor privacy reasons, such that the ALS measurement indicates low lightbut the computing device is not actually closed. In other exemplaryembodiments, the Hall sensor may be used on its own to determine whetheror not the computing device is in the closed position (i.e., withoutneeding to first perform stages 1101 and 1103).

In an example, when the computing device is in the closed position, theHall sensor of the multi-functional ALS package may measure a magneticfield at or near magnetic field saturation levels on the order of 100 sof mT (milliTesla). Upon detection of low magnetic field (e.g., 10 s ofmT or less) or no magnetic field being present, the computing device maydetermine that the computing device is in an open position thereforeshould be in an active state.

At stage 1113, the computing device obtains a capacitive SAR proximitymeasurement via an antenna, and at stage 1115, the computing devicedetects whether a human body is within 0-10 mm of the computing devicebased on the obtained capacitive SAR proximity measurement. If a humanbody is not present, the computing device maintains a normal wirelesspower for optimal connection to a wireless transmission source (stage1117). On the other hand, if a human body is present, the computingdevice regulates its transmission power to be relatively lower so as tocomply with SAR-related requirements (stage 1119).

As shown in FIG. 10 , stage 1113 may be performed in response to an ALSmeasurement being above an ambient light threshold and further inresponse to the computing device verifying that it is not in the closedstate based on a Hall effect measurement, such that SAR proximitysensing is only performed when the computing device is in an open stateand not when it is in a closed state. In other exemplary embodiments,SAR proximity sensing is performed by the computing device both when thecomputing device is in the open state and also when it is in the closedstate.

It will be appreciated that in accordance with exemplary embodiments ofFIG. 10 , the multi-functional ALS package may control the ALS sensing,the Hall sensing, and the SAR sensing to obtain the correspondingmeasurements, and another processor or processing system of thecomputing device (such as a central processing unit) may performdeterminations and/or responsive operations based on the measurements(such as with respect to dimming or turning off the display, loweringtransmission power, etc.). For example, the multi-functional ALS packagemay be a 3-in-1 chip which informs a main CPU as to the state of thethree respective sensors associated with the 3-in-1 chip, and the mainCPU may then control functions such as wireless transmission (e.g.,power level and/or ON/OFF status) and/or display (e.g., brightness leveland/or ON/OFF status) based thereon. It will be appreciated that inother exemplary embodiments, there may be different distributions ofoperations between one or more controllers of the multi-functional ALSpackage and one or more other processors of the computing device.

All references, including publications, patent applications, andpatents, cited herein are hereby incorporated by reference to the sameextent as if each reference were individually and specifically indicatedto be incorporated by reference and were set forth in its entiretyherein.

The use of the terms “a” and “an” and “the” and “at least one” andsimilar referents in the context of describing the invention (especiallyin the context of the following claims) are to be construed to coverboth the singular and the plural, unless otherwise indicated herein orclearly contradicted by context. The use of the term “at least one”followed by a list of one or more items (for example, “at least one of Aand B”) is to be construed to mean one item selected from the listeditems (A or B) or any combination of two or more of the listed items (Aand B), unless otherwise indicated herein or clearly contradicted bycontext. The terms “comprising,” “having,” “including,” and “containing”are to be construed as open-ended terms (i.e., meaning “including, butnot limited to,”) unless otherwise noted. Recitation of ranges of valuesherein are merely intended to serve as a shorthand method of referringindividually to each separate value falling within the range, unlessotherwise indicated herein, and each separate value is incorporated intothe specification as if it were individually recited herein. All methodsdescribed herein can be performed in any suitable order unless otherwiseindicated herein or otherwise clearly contradicted by context. The useof any and all examples, or exemplary language (e.g., “such as”)provided herein, is intended merely to better illuminate the inventionand does not pose a limitation on the scope of the invention unlessotherwise claimed. No language in the specification should be construedas indicating any non-claimed element as essential to the practice ofthe invention.

Exemplary embodiments are described herein. Variations of thoseexemplary embodiments may become apparent to those of ordinary skill inthe art upon reading the foregoing description. It is understood thatskilled artisans are able to employ such variations as appropriate, andthe invention may be practiced otherwise than as specifically describedherein. Accordingly, this invention includes all modifications andequivalents of the subject matter recited in the claims appended heretoas permitted by applicable law. Moreover, any combination of theabove-described elements in all possible variations thereof isencompassed by the invention unless otherwise indicated herein orotherwise clearly contradicted by context.

1. A touchscreen display device, comprising: a display; a flexibleprinted circuit; touch sensing electrodes connected to the flexibleprinted circuit; and a multi-functional ambient light sensor packagemounted on the flexible printed circuit, the multi-functional ambientlight sensor package comprising: an ambient light sensor; transmitterand receiver circuitry connected to the touch sensing electrodes via theflexible printed circuit; and a controller configured to obtaincapacitance information from the touch sensing electrodes and ambientlight information from the ambient light sensor via a single chip. 2.The touchscreen display device according to claim 1, wherein theflexible printed circuit comprises a cutout, and wherein the ambientlight sensor is configured to detect ambient light that has passedthrough the cutout.
 3. The touchscreen display device according to claim2, wherein the display comprises an aperture aligned with the cutout,and wherein the ambient light detected by the ambient light sensorpasses through the aperture of the display before passing through thecutout of the flexible printed circuit.
 4. The touchscreen displaydevice according to claim 2, wherein the display is offset from thecutout, and wherein the touchscreen display device further comprises aspacer offset from the display.
 5. The touchscreen display deviceaccording to claim 1, wherein the transmitter and receiver circuitry isfurther connected to an inductor, and wherein the controller of themulti-functional ambient light sensor package is further configured toobtain inductance information for inductive sensing.
 6. The touchscreendisplay device according to claim 1, wherein the multi-functionalambient light sensor package is packaged as a wafer-level chip-scalepackage (WLCSP).
 7. The touchscreen display device according to claim 1,further comprising heatsink material disposed between the display andthe flexible printed circuit.
 8. A computing device system, comprising:an antenna; a printed circuit board; and a multi-functional ambientlight sensor package mounted on the printed circuit board, themulti-functional ambient light sensor package comprising: an ambientlight sensor; a closure sensor; and a controller configured to obtaincapacitance information from the antenna for specific absorption rate(SAR) proximity sensing, closure information from the closure sensor,and ambient light information from the ambient light sensor via a singlechip.
 9. The computing device system according to claim 8, wherein themulti-functional ambient light sensor package is packaged as awafer-level chip-scale package (WLCSP).
 10. The computing device systemaccording to claim 8, wherein the multi-functional ambient light sensorpackage is packaged as an optical quad flat no-lead (OQFN) package, anoptical dual flat no-lead (ODFN) package, or an optical land grid array(OLGA) package.
 11. The computing device system according to claim 8,wherein the printed circuit board comprises a cutout aligned with theambient light sensor of the multi-functional ambient light sensorpackage, and wherein the ambient light sensor is configured to detectambient light that has passed through the cutout.
 12. The computingdevice system according to claim 8, further comprising a microphone, acamera, and/or a second controller, wherein the microphone, the camera,and/or the second control are disposed on the printed circuit boardand/or one or more other printed circuit boards.
 13. The computingdevice system according to claim 8, wherein the antenna is a laserdirect structuring (LDS) antenna, an FPC antenna, a PCB antenna, or adiscrete wire antenna.
 14. The computing device system according toclaim 8, wherein the computing device system is part of a laptop, andthe antenna, the printed circuit board, and the multi-functional ambientlight sensor package are disposed in a top area of a bezel of a lid ofthe laptop.
 15. The computing device system according to claim 8,wherein the computing device system is part of a tablet, and theantenna, the printed circuit board, and the multi-functional ambientlight sensor package are disposed in a top area of a bezel of thetablet.
 16. A multi-functional ambient light sensor package, comprising:an ambient light sensor; transmitter and receiver circuitry connected toone or more electrodes; and a controller configured to obtaincapacitance information from the one or more electrodes and ambientlight information from the ambient light sensor via a single chip. 17.The multi-functional ambient light sensor package according to claim 16,further comprising a closure sensor, wherein the controller is furtherconfigured to obtain closure information via the closure sensor, andwherein the closure sensor is a Hall sensor or an inductive sensor. 18.The multi-functional ambient light sensor package according to claim 16,wherein the transmitter and receiver circuitry is further connected toan inductor, and wherein the controller of the multi-functional ambientlight sensor package is further configured to obtain inductanceinformation for inductive sensing.
 19. The multi-functional ambientlight sensor package according to claim 16, wherein the multi-functionalambient light sensor package is packaged as a wafer-level chip-scalepackage (WLCSP).
 20. The multi-functional ambient light sensor packageaccording to claim 16, wherein the multi-functional ambient light sensorpackage is packaged as an optical quad flat no-lead (OQFN) package, anoptical dual flat no-lead (ODFN) package, or an optical land grid array(OLGA) package.